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According to Morgan Stanley, the market is undervaluing the significance of advanced packaging in semiconductors for artificial intelligence (AI). Advanced packaging refers to the process of packaging integrated circuits to enhance functionality, performance, and efficiency of AI chips. It is seen as a critical means of increasing processing power for AI systems. The demand for AI computing power, memory, and new chip architectures is expected to drive the innovation in advanced packaging.
Morgan Stanley predicts that the market for advanced packaging will reach $116 billion by 2027. The bank identifies potential winners in Japan, South Korea, and the European Union. It recommends investing in companies like Amkor, ACM Research, TSMC, AP Memory, Disco, and Advantest, which are at the forefront of AI computing or are part of packaging supply chains. These companies are expected to benefit from the growth in advanced packaging.
Brief news summary
According to Morgan Stanley, the market is overlooking the potential of advanced packaging in semiconductors, a crucial technology for increasing the capabilities of AI chips. Packaging involves protecting and connecting fabricated chips to external devices, and it is expected to drive the performance of AI chips. Packaging is now seen as a primary way to enhance performance, and Morgan Stanley predicts that the advanced packaging market will reach $116 billion by 2027. The bank sees significant opportunities in Japan, South Korea, and the European Union. It identifies specific companies, such as Amkor, ACM Research, TSMC, AP Memory, Disco, and Advantest, that can benefit from the growth in advanced packaging.
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